Debond and Cleave

Debond and Cleave (DB&C) Tool

THE DB&C TOOL IS A SMALL FOOTPRINT TOOL DESIGNED FOR LAYER TRANSFER APPLICATIONS IN HIGH VOLUME MANUFACTURING.

Applications:

SOI (silicon-on-insulator) Used to reduce device voltage operation and power consumption, improve device speed.
DSB (direct silicon bond) Improved device mobility in CMOS circuitry by providing separate crystal orientation layers for NMOS and PMOS.
SOQ (silicon-on-quartz) Transferred single-crystal silicon onto a quartz substrate used for RF, display and optical applications.
SOG (silicon-on-glass) Transferred single-crystal silicon onto bulk glass enabling low-cost, high-efficiency solar cells, displays, and optical applications.
CSS (customer-specific-substrate) A combination of donor-layer materials on unique handle substrates, including III-V and II-VI donor materials and sapphire, ceramics, and flexible handle substrates.

The process is a dynamic, low stress cleave action in which a donor layer transfers to a handle wafer at room temperature. SiGen's proprietary cleave technology combines a cleave initiation action followed by programmed propagation that optimizes cleave quality and uniformity.

Additional info

Debond & Cleave Tool (DB&C) (275KB PDF Format)

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